L1: Exactly filled number of PCB help us calculate time for whole project and estimate delivery time as well as give you amount discount. back

   L2: Asked delivery time for your project. This not include needed time for receiving all components needed for PCB assembly. There is not also sure, that shorter delivery time will be understood as express delivery. It depend on technological difficulty and used components. back

   L3: Defines, who will provide printed circuit to your project. Selection of this item affects logistical cost of this project. back

   L4: Defines, who will provide an electronics components to your project. Selection of this item affects logistical cost of this project. back

   L5: Our math algorithm use for calculating stencil printing however we are able dispense soldering paste or glue. Access to this option is in case, that customer want supply PCBs. back

   P1: Size of PCB is important for calculation of throughput of production line and combine technological steps. back

   P2: Size of PCB is important for calculation of throughput of production line and combine technological steps. back

   P3: Multiples of figures present on one board save cost of production. We recommend keep suggested amount of figures. Please note don't forget keep technological edges min. 5 mm. This edges can be cut down after PCBs manufacturing, back

   P4: This answer tell us how can be possible solder multilayer PCB as well as SMD components with higher relative mass which can cool temperature of near area and affected correct soldering of other components. In case, that you choose yes, its will count with vapour phase soldering technology. back

   P5: Semirigid foiled printed circuits are more difficult for machinery manufacturing as well as hand work. back

   T1: Here write amount of species and summary amount of „bigger“ SMD, which you will count on TOP side of PCB. This record allows us determine amount of needed components feeders and amount of components itself. This record affects working and logistic services price. back

   T2: Here write amount of species and summary amount of „smaller“ SMD, which you will count on TOP side of PCB. This record allows us determine amount of needed components feeders and amount of components itself. This record affects working and logistic services price. back

   T3: Here write amount of species and summary amount of THT components, which you will count on TOP side of PCB. This record affects working and logistic services price. back

   T4: Here should be write amount of solder pads from BOTtom side of PCB, which is needed solder to contact legs of THT deviceses placed from TOP side. This record allows us determine best soldering advance and affect cost of work. back

   B1: Here write amount of species and summary amount of „bigger“ SMD, which you will count on BOT side of PCB. This record allows us determine amount of needed components feeders and amount of components itself. This record affects working and logistic services price. back

   B2: Here write amount of species and summary amount of „smaller“ SMD, which you will count on BOT side of PCB. This record allows us determine amount of needed components feeders and amount of components itself. This record affects working and logistic services price. back

   B3: Here write amount of species and summary amount of THT components, which you will count on BOT side of PCB. This record affects working and logistic services price. back

   B4: Here should be write amount of solder pads from TOP side of PCB, which is needed solder to contact legs of THT deviceses placed from BOT side. This record allows us determine best soldering advance and affect cost of work. back

   S1: This value allows us determine SMD correlation between TOP na BOT PCB sides as well as verify summary checksum of used components. You can také value from Bill of Materials and compare it with placing plan. back

   S2: This value allows us determine THT devices correlation between TOP na BOT PCB sides as well as verify summary checksum of used components. You can také value from Bill of Materials and compare it with placing plan. back

   C1: Výběr laku, který má být použit pro lakování DPS. Doporučujeme se přiklonit našemu implicitnímu laku, který splňuje nejvyšší nároky na ochranu a zároveň je trasovatelný pod UV světlem. Je častou volbou většiny zákazníků.Pokud však zvolíte "ne", pak ve výpočtu bude zahrnut poplatek za výměnu laku, jež vyžaduje i vyčištění aplikačních okruhů a dispenzních trysek lakovacího automatu. Také musíme upozornit na případné náklady spojené s ředěním laku na požadovanou aplikační hustotu. V neposlední řadě může být problém s výraznou těkavostí a zápachem vámi požadovaného laku, pak úplně vylučujeme možnost uplatnění ve výrobě.Volbou "ne" také nebude zahrnut lak a pomocné chemikálie (čistidlo a ředidlo) ve výpočtu ceny. Bude to nabídnuto separátně v cenách za nominální balení výrobce. back

   C2: Zde vybíráte, na které strany DPS se bude aplikovat lak. Oboustranné lakování může přinést náklady spojené s technologickou pauzou mezi dosušením jedné vrstvy a následnou aplikaci laku na druhou vrstvu. back

   A1: Here you will choose if you need post process PCB washing however we are using non corrosive solder substances. This record affects working price. back

   A2: Here you will choose if you need ensure identification of each PCB running thru production line. This record affects working price. back

   A3: Here you will choose if you need protect some solder pads against soldering in tin wave. It is useful when you going solder here some next parts. This record affects working price. back

   A4: Your project are usually more sophisticated and electronics assemblies should be tested or EEPROM with software loaded etc. Here you fill time you expect for this task. This record affects working price. back

   A5: This option tell us if you want keep PCBs as multiple figures on one board for example for next fabrication. This record affects working price. back

   A6: This option tell us what next manufacturing steps you expect. Here is mentioned various mechanical works. Recorded time should be realistic and telling us your estimated time neede to do all mentioned working steps. This record affects working price. back

   A7: Nabídka není aktivní, služba se do automatického výpočtu připravuje. Děkujeme za pochopení. back

   I1: Here you can fill up company name, project identification, P/N of your product etc. Don't record your protected datas!!! back

   I2: Here is place for filling name and surname of person who filled this entry form. Don't record your private protected datas!!! back

   I3: Here you can record notes and comments you want to draw attention for. Don't record your private protected datas!!! back

   I4: Here is place for e-mail address where should be send calculated price offer. We will get copy of this offer and you can simply mention it when our business talks will continue. Don't record your private protected datas!!! back

   I5: This is anti spam protection. Please fill up field by result of simple mathematics task. back

   M1, M2: Primarily intended for calculations within the company PEWTRONIC s.r.o. This affects the total project costs. If this information is not provided, the material cost will not be included in the total project costs. back

   T5, B5: Soldering pads, which are near or in area of placed SMD there is high probability, that during tin wave solder process will apply tin also here and cause demaging or shorts between devices. This also valid for SMD sennisitive packages as optical or acustic devices etc. For example the same situation can caused also two solder pads of THT capacitor surrounded by placed SMD. In mentioned cases is neccessary choose in production selective wave soldering or hand soldering. We know, that this option is difficult answer for layman, but this information can rapidly change price for assembly when is applied more THT per PCB or for higher production batch. When you are not sure, keep option Yes and then is valid condition mentioned in article T4 and B4. back

   T1, T2, B1, B2: Long praxis show us, that each projects use other componets and has other range and difficulty. Why we separate SMD to bigger and smaler? Answer is easy. We would like optimalize production and cost by determinating for suitable machinery. We dispose with machinery with laser centering of SMD, simple for programing and device feeding, but placeing slowly than other high precise camera centering machines. But this faster machines takes more time for programing and feeder preparation. Our math algoritnm decise what is cheaper for customer. Bigger components are also more simple for visual inspection and next fabrication. back